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High Frequency PCB/PCBA Strength Manufacturer. More About Our PCB Advantages and PCB Application Market Trends

Shenzhen Xinchenger Electronics Co., Ltd. is a one-stop solution strength factory for high-reliability PCB and PCBAs, with rich experience from single-sided to complex multi-layer printed circuit boards and top-level assemblies (PCBA).

We can provide 24 hours fast sample service in time to win business opportunities for our customers. Meanwhile, our company has more than ten years of strong production experience, skillful craftsmanship, engineering technology and excellent service. We have the advantages of high quality, low cost and foreign information technology support.


Our main sales areas include:

A. Asia: In addition to Chinese Mainland, domestic mobile phones are sold in other Asian regions, such as Hong Kong, Taiwan, Singapore, Malaysia, Indonesia, the Philippines, Vietnam, Thailand, etc.

B. European Market: Domestic mobile phones are sold in many countries in Europe, such as the UK, Germany, France, Italy, Spain, and the Netherlands.

C. North American Market: including developed countries such as the United States and Canada.

D. Latin America: including markets in countries such as Brazil, Mexico, and Argentina.

E. Middle Eastern Market: including markets in Middle Eastern countries such as Saudi Arabia, the United Arab Emirates, and Israel.

F. African Market: including markets in African countries such as South Africa, Nigeria, and Kenya.


High frequency PCB refers to a special type of circuit board with high electromagnetic frequency, used in the fields of high frequency (frequency greater than 300MHz or wavelength less than 1 meter) and microwave (frequency greater than 3GHz or wavelength less than 0.1 meter). It is a circuit board produced on a microwave substrate copper clad board using some processes of ordinary rigid circuit board manufacturing methods or special processing methods.



The printed circuit PCB, known as the “mother of electronic products”, is an important component of electronic components and its application value in servers is also continuously improving. PCB is used in almost all electronic products, and its quality not only directly affects the reliability of electronic products, but also affects the integrity of signal transmission between chips. In the new wave of hardware innovation, the growth trend of PCB design industry is determined, and the market size is huge. At the same time, especially the new high-frequency PCB products with high standards, their value is almost 5-6 times that of traditional ordinary PCB. Driven by the market, global PCB manufacturers have been comprehensively improving product quality and core competitiveness in recent years. Coupled with the expansion of market demand, the upward trend of the PCB industry is also becoming increasingly rapid.

A. The prosperity of intelligent product innovation will drive the continuous expansion of high-frequency PCB research and development demand:

With the arrival of the 5G era, the artificial intelligence industry is rapidly developing, and the upgrade of server chips has comprehensively driven the upgrading of the PCB industry, putting forward higher requirements for core performance indicators such as layer count, transmission loss value, design flexibility, and resistance function. The fields of network communication and integrated circuits are benefiting positively, and the characteristics of 5G high-speed transmission, massive connectivity, low latency, and further development of AI technology have injected new momentum into broader hardware innovation fields such as Industry 4.0, medical electronics, the Internet of Things, and automotive electronics. In the future, the application scenarios of intelligent hardware will gradually enrich, and the popularization of intelligent electronic products will be an inevitable trend. The types and quantity of devices will maintain rapid growth. As an important component of electronic products, PCB research and development itself is a fundamental part of hardware research and development. Therefore, the prosperity of terminal product innovation will drive the continuous expansion of PCB research and development demand.


B. The increasing difficulty of high-frequency PCB research and development, as well as the increase in the amount of single hardware equipment and high-frequency PCB usage, have led to a rapid increase in the demand for high-frequency PCB research and development:

With the doubling of the working speed of integrated circuits, PCB are gradually developing towards high-density, high-precision, high reliability, multi-layer, high-speed transmission (high frequency PCB), and other directions. Its technological content and complexity are constantly increasing, and product structures are inclined towards varieties with high technological content such as packaging substrates, rigid flexible bonding, HDI, etc. At the same time, the increase in electronic penetration rate of intelligent hardware and the enrichment of functions have also led to a general increase in the usage of high-frequency PCB for single devices. Therefore, on the basis of the increasing demand for hardware innovation equipment level research and development, the increasing difficulty of high-frequency PCB research and development and the increasing usage of high-frequency PCB in single equipment have led to a rapid increase in high-frequency PCB research and development demand. Insufficient high frequency PCB research and development capabilities may further become a constraint on enterprise research and development innovation capabilities and efficiency, and there is a strong demand for commercial high-frequency PCB research and development services.


C. The artificial intelligence industry promotes the upgrading and transformation of the PCB industry:

From a functional perspective, PCB plays a bridging role in electronic components. Especially in the server field, PCB are showing a development trend of “high-speed and high-frequency, miniaturization, portability, and multifunctional”. Because for the computer and server industries, the high-speed and high-frequency 5G era and the wave of AI technology have put forward higher requirements and standards for PCB. The comprehensive improvement of communication frequency and transmission rate requires greater computational power support, and PCB must ensure high-speed and stable operation, inevitably meeting the technical requirements of low dielectric constant, low dielectric loss factor, and low roughness. Therefore, the process requirements for PCB in AI servers are much higher than traditional PCB, and PCB products with large dimensions, high layers, high order, high density, and high frequency and speed will gradually become the mainstream in the market.

D. PCB design is an important link in the PCB industry chain, located in the upstream research and development stage:

The upstream industry and downstream production and manufacturing of PCB are also closely related, both benefiting from the innovation and development of the electronics industry. Therefore, PCBA and China are the world’s largest production bases for PCB in the manufacturing sector, and the output value of PCB has steadily increased in recent years. The extension of the domestic PCB industry to high-end fields is driving it, and the PCB design industry is moving towards a higher level. With the technological innovation of downstream industries and national policy support, there will be a demand for PCB product updates and upgrades. In the future, there is good development space for the domestic mid to high end PCB field, which will directly drive the domestic PCB design industry to move towards a higher level.


E. High frequency PCB are superior to traditional PCB in terms of material performance requirements and number of layers:

From the perspective of the changes in the number of layers of PCB, AI models need to improve their computing power to manage an increasing amount of data. The packaging base for existing mainstream servers and memory is generally 6-16 layers. Entering the era of large-scale commercial use of artificial intelligence, high-end servers with 16 or more layers will become the mainstream of the market. Even with the continuous improvement of technological demand, the number of layers of PCB will continue to increase, and products with more than 20 layers of back layers will gradually increase the market supply. Among them, during the AI training phase, the PCB of the server will generally reach more than 20 layers.

F. The PCB industry is rapidly developing in China:

From the development process of the PCB industry, developed countries such as Europe, America, and Japan have started early, mature industries, and obvious competitive advantages. Data shows that before the 21st century, the United States, Japan, and Europe accounted for over 70% of global PCB production value. Since 2000, the PCB industry in Asia has started to rise comprehensively, especially in China. With its comprehensive advantages in resources, policies, and industrial clusters, China has begun to fully develop the PCB industry. In the process of transferring global industrial centers to Asia, China has become a global manufacturing center for PCB. Data shows that since 2006, China has officially surpassed Japan as the world’s largest PCB production base. In 2022, the total output value of China’s PCB industry has reached 44.2 billion US dollars, accounting for 54.1% of the global total. In recent years, with more enterprises increasing their technological research and industrial investment, the cluster advantage of China’s PCB industry has become more obvious. Many PCB manufacturers have formed their own competitive advantages and bargaining power in various sub fields.


We have great quality assured team ensure quality each part of PCB/PCBA. Turnkey PCB/PCBA assembly service is good choice for small companies or anyone that want to save time and cost. Get cost-effective, efficient means of assembling PCB/PCBA Turnkey service, you could email us to [email protected] with your Gerber & BOM for quote.


Company Name: Shenzhen Xinchenger Electronics Co., Ltd. 

Contact Person: Lisa Zhou

Email: [email protected]

Tel.: +86 18822859305

WhatsApp: +86 18822859305

Country: China

Read more: www.szxcepcb.com/


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