Dow Corning Electronics Develops High-Performance Thermally Conductive Compound for Intel’s New Mobile Processor Platforms

2008-08-19 20:10:00

     TC-5688 Demonstrates Excellent Thermal Performance and Exceptional

                  Resistance to Pump-Out in New Processor

    MIDLAND, Mich., Aug. 19 /EMWNews/ -- Dow Corning

Corporation's Electronics group today announced the immediate availability

of DOW CORNING(R) TC-5688 Thermally Conductive Compound - an

ultra-high-performance, non-curing thermal grease developed for use with

Intel Corp.'s newest mobile microprocessor - Intel(R) Core(R)2 Extreme

mobile processor QX9300.

    The DOW CORNING(R) TC-5688 Thermally Conductive Compound and a variety

of competitor thermal interface materials (TIMs) were subjected to

extensive thermal stress evaluation with the Quad-Core mobile tester and

live Intel(R) Core(R)2 Extreme mobile processor QX9300 testing. Dow

Corning's new thermal grease demonstrated the best initial

thermal-resistance values of any competitor TIM tested on the Quad-Core

mobile tester as well as exceptional resistance to pump-out, the tendency

of some TIMs to migrate from their usage area after repeated

thermal-expansion cycles, resulting in decreased performance. TC-5688 was

the only thermal grease compound tested to exhibit sufficient reliability

after repeated power cycling, while other thermal greases suffered severe


    TC-5688 offers extremely low thermal resistance at 0.05 degrees

C-cm(2)/W and a high level of thermal conductivity at 5.67 W/mK. It excels

in real-world applications involving non-uniform substrates and varying

bond line thicknesses. TC-5688 is also suitable for cooling other Intel

processors and in a wide array of non-computing areas - including power,

industrial and light-emitting diode (LED) applications - where

high-performance, highly reliable thermal materials are required.

    "Thermal greases are the preferred form of TIM for most computer

assemblers because of their excellent thermal performance, low cost and

ease of processing," said Andrew Lovell from Dow Corning's Thermal

Materials Group. "We are very excited about the outstanding performance of

our newest thermal grease developed for Intel(R) Core(R)2 Extreme mobile

processor QX9300. We have been developing a broad portfolio of thermal

materials in recent years, and the cutting-edge, market-leading

capabilities of TC-5688 significantly strengthen our product offerings for

the rapidly growing mobile PC market."

    Market researchers expect laptop computer shipments to reach 125

million in 2008 and to surpass desktop sales during 2010. TC-5688 is the

ideal thermal material for this growing market since it provides excellent

thermal performance and the highest reliability for the bare die processors

used in laptop computers.

    PC manufacturers use TIMs to carry heat away from microprocessors,

graphics processors and other critical components, typically by applying a

thin layer of the compound between a chip and a heat sink. Other emerging

thermal materials markets include LEDs, flat-panel displays and a variety

of communication and automotive products.

    Dow Corning Electronics offers global technical support for the new

material. Dow Corning's Electronics group serves the needs of the

electronics, optoelectronics and semiconductor industries with specialized,

high-purity silicone- and silicon-containing products and solutions.

    For more information on Dow Corning Electronics' full range of thermal

management materials, visit

    About Dow Corning

    Dow Corning Corporation is a globally integrated provider of materials,

application technology and services, and is focused on providing innovative

technologies that help its customers to invent the future. For more

information on Dow Corning, visit Dow Corning

Corporation is equally owned by The Dow Chemical Company (NYSE: DOW) and

Corning Incorporated (NYSE: GLW). More than half of Dow Corning

Corporation's sales are outside the United States.

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