LEUVEN, Belgium & SAN DIEGO–(EMWNews)–IMEC, Europe’s leading independent

nanoelectronics research institute, and Qualcomm Incorporated

(Nasdaq:QCOM), a leading developer and innovator of advanced wireless

technologies and data solutions, today announced that Qualcomm is the

first fabless integrated circuit company to participate in IMEC’s

industrial affiliation program (IIAP) on three-dimensional (3D)

integration. Qualcomm and IMEC researchers in the program will

collaborate to understand and develop solutions for the use of 3D

technologies in future wireless products.

“Now that Qualcomm, the world’s

leading fabless integrated circuit provider, has joined the 3D

integration program, we have all the major supply chain players working

together,” said Luc Van den hove, chief

operation officer at IMEC. “We are confident

that strong industry collaboration among foundries, IDMs, packaging and

assembly companies, and equipment suppliers at IMEC will push the

development of innovative 3D products forward.”

IMEC’s 3D integration program explores three

dimensional technology and design for application in various domains.

The technology research program focuses on 3D wafer-level packaging and

3D stacked-ICs to find innovative solutions for the cost-effective use

of 3D interconnects at different levels of the wiring hierarchy. The 3D

system-on-chip design research program provides insights to its

benefits, costs, challenges and solutions. The program will also include

the development and demonstration of the IP and tools necessary for

designing in three dimensions.

“Three-dimensional design will allow Qualcomm

to offer superior features and performance in our products,”

said Jim Clifford, senior vice president and general manager, Qualcomm

CDMA Technologies. “We are collaborating with

IMEC because their research and technology expertise will help us to

accelerate the implementation of 3D design in our products.”

Other partners in IMEC’s 3D integration

program are Amkor, Infineon, Intel, Micron, NEC, NXP, Panasonic,

Qimonda, Samsung, ST Microelectronics, Texas Instruments and TSMC.

The news release can be downloaded at:

http://www.imec.be/wwwinter/mediacenter/en/Qualcomm3DSemWest.shtml

About Qualcomm

Qualcomm Incorporated (www.qualcomm.com)

is a leader in developing and delivering innovative digital wireless

communications products and services based on CDMA and other advanced

technologies. Headquartered in San Diego, Calif., Qualcomm is included

in the S&P 500 Index and is a 2008 FORTUNE 500^®

company traded on The Nasdaq Stock Market^®

under the ticker symbol QCOM.

About IMEC

IMEC is a world-leading independent research center in nanoelectronics

and nanotechnology. IMEC vzw is headquartered in Leuven, Belgium and has

a sister company in the Netherlands, IMEC-NL, offices in the US, China

and Taiwan, and representatives in Japan. Its staff of more than 1,600

people includes more than 500 industrial residents and guest

researchers. In 2007, its revenue (P&L) was EUR 244.5 million.

IMEC’s More-than-Moore research aims at

semiconductor scaling towards sub-32nm nodes. With its More than Moore

research, IMEC looks into technologies for nomadic embedded systems,

wireless autonomous transducer solutions, biomedical electronics,

photovoltaics, organic electronics and GaN power electronics.

IMEC’s research bridges the gap between

fundamental research at universities and technology development in

industry. Its unique balance of processing and system know-how,

intellectual property portfolio, state-of-the-art infrastructure and its

strong network worldwide position IMEC as a key partner for shaping

technologies for future systems. Further information on IMEC can be

found at www.imec.be.

NOTE: Qualcomm is a registered trademark of Qualcomm Incorporated. All

other trademarks are the property of their respective owners.

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