UNITED STATES–(EMWNews – July 21, 2008) – – SINGAPORE — 7/22/2008 — STATS ChipPAC

Ltd. (“STATS ChipPAC” or the “Company”) (SGX-ST: STATSChP) (SES: S24), a

leading semiconductor test and advanced packaging service provider, today

announced it has won the 2008 Advanced Packaging Award in the 3D Packaging

Technology category for its Flip Chip Package-In-Package solution. This is

the second consecutive year in which STATS ChipPAC has been honored by the

Advanced Packaging Awards for achievements in 3D packaging technology. In

2007, STATS ChipPAC won the 3D Packaging Award for its innovative Fan-in

Package-on-Package (FiPoP) technology.

Flip Chip Package-In-Package (fcPiP) is an advanced flip chip integration

technology that combines the baseband, memory and analog functions of a

mobile communication device into a single package. The fcPiP effectively

integrates flip chip and wire bond interconnection within the same package

structure to deliver increased speed, performance and miniaturization. It

provides greater functional integration in a smaller form factor with an

overall reduction in total cost as compared to other 3D package stacking

solutions and is ideal for mobile phones and other portable consumer

electronics.

“We are very honored to receive the 2008 Advanced Packaging Award for our

fcPiP technology. The fcPiP is a flip chip integration package with an

innovative architecture that combines multiple package integration schemes

within a very small package to die ratio. The combined greater functional

integration in a smaller form factor with an overall reduction in total

cost as compared to other 3D package stacking solutions will help our

customers to be even more successful in the highly competitive mobile phone

and other handheld applications market,” said Dr. Han Byung Joon, STATS

ChipPAC’s Executive Vice President and Chief Technology Officer.

Instituted in 2004, the Advanced Packaging Awards honor the products and

technologies that have shaped the semiconductor industry over the years.

This year’s program recognized outstanding companies with innovative

technology advancements in 19 categories, one of which was 3D Packaging.

Selection criteria for the winners of the Advanced Packaging Awards were

evaluated based on their ability to meet a significant industry challenge,

creative application of a new or existing technology, overall quality and

consistency of performance, economic merits, and throughput

characteristics.

The winners of the 2008 Advanced Packaging Awards were recognized during a

ceremony that took place on July 16, 2008 at the St. Regis Hotel, San

Francisco.

Forward-Looking Statements

Certain statements in this release are forward-looking statements that

involve a number of risks and uncertainties that could cause actual events

or results to differ materially from those described in this release.

Factors that could cause actual results to differ include, but are not

limited to, general business and economic conditions and the state of the

semiconductor industry; level of competition; demand for end-use

applications products such as communications equipment and personal

computers; decisions by customers to discontinue outsourcing of test and

packaging services; our reliance on a small group of principal customers;

our continued success in technological innovations; pricing pressures,

including declines in average selling prices; availability of financing;

prevailing market conditions; our ability to meet the applicable

requirements for the termination of registration under the Exchange Act;

our ability to meet specific conditions imposed for the continued listing

or delisting of our ordinary shares on the Singapore Exchange Securities

Trading Limited (SGX-ST); our substantial level of indebtedness; potential

impairment charges; delays in acquiring or installing new equipment;

adverse tax and other financial consequences if the South Korean taxing

authorities do not agree with our interpretation of the applicable tax

laws; our ability to develop and protect our intellectual property;

rescheduling or canceling of customer orders; changes in our product mix;

intellectual property rights disputes and litigation; our capacity

utilization; limitations imposed by our financing arrangements which may

limit our ability to maintain and grow our business; changes in customer

order patterns; shortages in supply of key components; disruption of our

operations; loss of key management or other personnel; defects or

malfunctions in our testing equipment or packages; changes in environmental

laws and regulations; exchange rate fluctuations; regulatory approvals for

further investments in our subsidiaries; majority ownership by Temasek

Holdings (Private) Limited (Temasek) that may result in conflicting

interests with Temasek and our affiliates; unsuccessful acquisitions and

investments in other companies and businesses; labor union problems in

South Korea; uncertainties of conducting business in China and other

countries in Asia; natural calamities and disasters, including outbreaks of

epidemics and communicable diseases; and other risks described from time to

time in the Company’s SEC filings, including its annual report on Form 20-F

dated March 7, 2008. You should not unduly rely on such statements. We do

not intend, and do not assume any obligation, to update any forward-looking

statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging

design, assembly, test and distribution solutions in diverse end market

applications including communications, digital consumer and computing. With

global headquarters in Singapore, STATS ChipPAC has design, research and

development, manufacturing or customer support offices in 10 different

countries. STATS ChipPAC is listed on the SGX-ST. Further information is

available at www.statschippac.com. Information contained in this website

does not constitute a part of this release.