Innovative Solution Delivers Cost-Effective, Multisite Mixed-Signal SoC and SiP Testing

MILPITAS, CA–(EMWNews – July 23, 2008) – Credence Systems Corporation (NASDAQ: CMOS), a

provider of test solutions for the worldwide consumer semiconductor

industry, announced today that its innovative MultiWave instrument for the

Diamond test platform has received the Advanced Packaging Best New Product

Award in the Test and Services category. MultiWave integrates the

functionality of multiple instruments into one multi-channel arbitrary

waveform generator and digitizer unit to provide the industry’s most

cost-effective mixed-signal solution for multisite testing of highly

integrated system-in-package (SiP) and system-on-chip (SoC) devices.

“We are committed to offering our customers the best value in test, and the

Diamond MultiWave instrument solves a full range of testing challenges for

cost competitive markets. High-level integration combined with the lowest

cost per channel help to address the relentless pressure to reduce the cost

of test,” said Lavi Lev, president and CEO of Credence. “We are delighted

that Advanced Packaging has recognized the excellence of the Diamond

MultiWave by presenting us with this award.”

Celebrating excellence in semiconductor packaging, the Advanced Packaging

Awards are presented to the finest examples of creative advancement in

semiconductor technology.

“We congratulate Credence on their win of the prestigious Best New Product

award in the Testing Equipment and Services category,” stated Gail Flower,

editor-in-chief, Advanced Packaging magazine. “Advanced Packaging is proud

to continue its tradition of recognizing excellence in this segment of the

industry. In recent years, innovations in advanced packaging processes,

materials, and equipment have been driving the semiconductor industry

forward. Now more than ever, it’s important to acknowledge the achievements

of these innovators.”

The Diamond MultiWave provides a cost-optimized mixed-signal solution for

multisite testing, incorporating four arbitrary waveform generators and

four digitizers into a single compact instrument. MultiWave allows for

fully parallel, concurrent testing of audio and video SiP and SoC

components. This enables the significant cost of test reductions demanded

by very competitive markets, while also offering maximum fault coverage

with minimum test time. Additionally, the Diamond MultiWave helps customers

leverage complex SiP technology, which is increasingly being used in new

consumer product designs to optimize overall system cost and efficiency.

The Diamond test platform — including the ten-slot Diamond 10 and

forty-slot Diamond 40 — delivers unprecedented performance and

flexibility. An innovative, high-throughput, multi-purpose wafer sort and

final test solution, the Diamond platform is specifically designed to

address the economic requirements of the ultra-competitive consumer

mixed-signal device markets. The Diamond is also optimized for the 200-Mbps

probe market and supports massive multisite production of devices such as

microcontrollers, wireless baseband ICs, display driver controllers, etc.

About Credence

Credence Systems Corporation is a global provider of automated test

equipment (ATE) solutions to the high growth, consumer semiconductor

industry. Credence is committed to deliver the highest standards of

value — an optimal combination of technology, turn-around time,

reliability, ease of use, service and support — to every customer, which

enables important cost and performance advantages for integrated device

manufacturers (IDMs), wafer foundries, outsource assembly and test (OSAT)

suppliers and fabless chip companies worldwide. An ISO 9001-certified

company with a presence in 20 countries, Credence is headquartered in

Milpitas, California. More information is available at

http://www.credence.com.

Credence is a registered trademark of Credence Systems Corporation. Other

trademarks that may be mentioned in this release are the intellectual

property of their respective owners.