Fab Process Engineers Conduct Comparative Analysis of Equipment Acceleration, Vibration With New VibeReview Software for Wireless Accelerometer From CyberOptics Semiconductor, Inc. — WaferSenseTM AVS

WaferSense AVS’ Expanded VibeView 1.5 Indicates Vibration Frequency, Go, No-Go Parameters; New 300mm Light Version Directly Enters Chambers

BEAVERTON, OR–(EMWNews – August 6, 2008) – Software engineers at a maker of wireless metrology devices for wafer

processing equipment, CyberOptics Semiconductor, Inc. (CSI), have

recently developed companion applications that allow fab engineers to

evaluate equipment acceleration and vibration via comparative analysis of

log file data and real-time frequency and

spec-limit readings in conjunction with the company’s wafer-like

accelerometer

— the WaferSense™

Auto Vibration System (AVS), according to Dennis J. Bonciolini, the

company’s CTO.

The amplitude and frequency of vibrations generated by fab process

equipment and automated material handling systems, when tracked,

effectively serve as predictors of robot and transfer-equipment failures

and indicators of both wafer particle-contamination sources and inefficient

movement by cassettes,

SMIFs and FOUPs, according to Bonciolini.

Bonciolini said the company, a subsidiary of CyberOptics Corp. (NASDAQ: CYBE), developed the new software — partly due to demand from fabs — to

help process engineers further review and analyze data generated by the

wafer-like AVS. Engineers use the data to establish yield-based vibration

standards for equipment and technicians, identify links between vibration

frequency, such as isolated shocks versus steady humming, and likely

sources and acceptable acceleration parameters for equipment.

“With the data, you can see that there’s really a direct relationship

between yield and the speed and vibration of equipment across the fab,”

Bonciolini said. “The more you optimize acceleration and limit vibration,

you’re going to encounter less downtime and contaminated wafers and improve

your cycle time.”

The company’s new VibeReview™ 1.5 for AVS replays stored log file data for

engineers to compare different run-times, tools and trigger values for

acceleration during wafer transfer in x, y and z directions at a range of

+/-2G. The improved VibeView™ 1.5 for AVS allows engineers to evaluate

vibration frequency between 0 and 200 Hz and establish ongoing, real-time

spec limits or go, no-go values, including RMS. Users can also pause and

resume data recording, create log-file titles and export data to Excel and

MATLAB.

Bonciolini added that CyberOptics Semiconductor also reduced the form

factor of the AVS device’s carbon fiber composite housing to develop a

lighter, more flexible 300mm version. The light 300mm device now weighs 190

grams, down from 225 grams, and is primarily designed to enter slit valves

and vacuum chambers without exposing process areas to the environment.

“The lighter device can access more equipment at 300mm fabs and essentially

identify more wafer-damaging processes,” Bonciolini said.

WaferSense AVS’ key specifications and features include form factors of

SEMI 200mm notch or flat and 300mm, range of +/-2G, resolution of +/-0.01G,

operating pressure of 760 to less than 10 -6 Torr, operating temperature of

20 to 70 degrees Celsius, height of 6.3mm, weight of 150gm at 200mm and

190gm at 300mm (light), wireless Bluetooth link, four hour run-time per

battery charge and use with Windows 2000, XP and Vista.

The WaferSense AVS package includes the vibration-sensing wafer,

USB-compatible link, VibeView™ and VibeReview™ graphical software CD,

charging case and suitcase.

The WaferSense family of products includes the Auto Vibration System (AVS),

Auto Leveling System (ALS), Auto Teaching System (ATS) and Auto Gapping

System (AGS). Each device follows the processing life of a wafer.

About CyberOptics Semiconductor, Inc.

CyberOptics Semiconductor develops automated products that seamlessly

measure critical parameters in semiconductor fabrication processes and

equipment. The company’s pioneering WaferSense™ line includes wireless

metrology devices for vibration, leveling, gapping and teaching

semiconductor process equipment. The company is the largest producer of reflective wafer-mapping sensors and a leading provider of frame grabber machine vision boards

under its HAMA Sensors™ and Imagenation™ brands. CyberOptics Semiconductor

is a subsidiary of CyberOptics Corp. (NASDAQ: CYBE), one of the world’s

leading providers of process yield and throughput improvement solutions for

electronic assembly and semiconductor capital equipment companies. For

information, visit http://www.cyberopticssemi.com/, e-mail

[email protected] or call

800-366-9131.

“Safe Harbor” Statement under the Private Securities Litigation Reform Act

of 1995: Statements regarding the Company’s anticipated performance are

forward-looking and therefore involve risks and uncertainties, including

but not limited to: market conditions in the global SMT and semiconductor

capital equipment industries; increasing price competition and price

pressure on our product sales, particularly our SMT systems; the level of

orders from our OEM customers; the availability of parts required for

meeting customer orders; the effect of world events on our sales, the

majority of which are from foreign customers; product introductions and

pricing by our competitors; unanticipated costs or delays associated with

the transition of engineering and manufacturing for SMT Systems to

Singapore and other factors set forth in the Company’s filings with the

Securities and Exchange Commission.

Note: all trademarks and registered trademarks are the property of their

respective owners.

Contacts: Ehrlich Written Communications CyberOptics Semiconductor Media Relations: Chris Ehrlich, Principal 503-925-1600 x1 http://www.ewcomm.com/ CyberOptics Semiconductor, Inc. Lindsey Dietz 503-495-2217 http://www.cyberopticssemi.com/