FormFactor Improves Wafer Test Uptime With RapidSoak(TM) Probe Card Productivity Technology
2008-07-28 16:00:00
FormFactor Improves Wafer Test Uptime With RapidSoak(TM) Probe Card Productivity Technology
FormFactor Improves Wafer Test Uptime With RapidSoakTM Probe Card Productivity Technology
LIVERMORE, CA–(EMWNews – July 28, 2008) – FormFactor, Inc. (
announced it has developed a new technology to enhance its advanced wafer
probe cards and offer improved performance and productivity to its
customers. The new technology, known as RapidSoak, is designed to reduce
the time required for the probe card to reach thermal stability.
FormFactor is making the RapidSoak technology feature available on its
Harmony™ architecture probe cards, which are used for full-wafer contact
testing, and on its PH150XP probe cards. Both platforms are used to test
memory devices on 200- and 300-mm wafers.
“As we reduce wafer test time with full-wafer contactors, soak time has a
larger impact on test cell utilization,” stated Stefan Zschiegner, vice
president of the DRAM product business unit at FormFactor. “With our
RapidSoak technology, we can reduce soak time — in some test cell
configurations very dramatically — adding productivity back to the test
cell and increasing our customers’ throughput.”
Test temperature recalibration is necessary during probe card installation,
wafer exchanges, lot changes and probe card maintenance. Depending on the
device type, test times and manufacturing volume, these “soak” times can
amount to hours of lost productivity each day. “RapidSoak technology is an
example of FormFactor’s commitment to find innovative solutions to optimize
productivity for our customers’ next generation devices,” added Zschiegner.
“By improving test cell productivity, we can help our customers lower their
cost of test, which is a fundamental driver of our engineering efforts.”
The RapidSoak feature is available now as an option on new FormFactor
Harmony and PH150XP probe cards.
About FormFactor
Founded in 1993, FormFactor, Inc. (
wafer probe cards, which are used by semiconductor manufacturers to
electrically test ICs. The company’s wafer sort, burn-in and device
performance testing products move IC testing upstream from post-packaging
to the wafer level, enabling semiconductor manufacturers to lower their
overall production costs, improve yields, and bring next-generation devices
to market. FormFactor is headquartered in Livermore, California with
operations in Europe, Asia and North America. For more information, visit
the company’s web site at www.formfactor.com.
FormFactor, Harmony and RapidSoak are trademarks or registered trademarks
of FormFactor, Inc.
Forward-Looking Statements
Statements in this press release that are not strictly historical in nature
are forward-looking statements within the meaning of the federal securities
laws, including statements regarding business momentum, demand for our
products and solutions and future growth. These forward-looking statements
are based on current information and expectations that are inherently
subject to change and involve a number of risks and uncertainties. Actual
events or results might differ materially from those in any forward-looking
statement due to various factors, including, but not limited to: the
company’s ability to implement its RapidSoak technology into its
Harmony-architecture and PH150XP wafer probe cards; the company’s customers
realization of reduced soak times if they implement RapidSoak, and whether
they can realize a dramatic reduction in soak time, thereby adding
productivity to the test cell and increasing throughput; the company’s
ability to introduce innovative solutions to optimize productivity for its
customers’ next generation devices, and the company’s ability to enable its
customers to lower their cost of test. Additional information concerning
factors that could cause actual events or results to differ materially from
those in any forward-looking statement is contained in the company’s Form
10-K for the year ended December 29, 2007, and the company’s Form 10-Q for
the quarterly period ended March 29, 2008, filed with the Securities and
Exchange Commission (“SEC”), and subsequent SEC filings. Copies of the
company’s SEC filings are available at
http://investors.formfactor.com/edgar.cfm. The company assumes no
obligation to update the information in this press release, to revise any
forward-looking statements or to update the reasons actual results could
differ materially from those anticipated in forward-looking statements.
Investor Contact: Michael Magaro Investor Relations (925) 290-4949 Trade Press Contact: |
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